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 Click to enlarge image
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Solder Pater
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* Sparkle Paste OZ Series
The SPARKLE PASTE OZ series takes the "im" out of "impossible".
Thanks to a spherical (OZ) solder poweder and a flux with excellent chemical
stability, you may now use indium alloy pastes with the OZ series. The
Series also provides significantly longer shelf lives for ordinary solder
alloypastes and a wide range of products to satisfy your particular alloy
composition, grain size, flux type, and melting temperature nees. Good
printability and exellent dispensability makes a high quality reflow soldering.
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* Application
SPARKLE
PASTE OZ series products can
be used with infrared reflow
furnace, VPS, and laser beam
heating systems for surface
mount and other reflow soldering
applications including electronic
component assembly, sealing,
bump forming, semiconductor
device, die bonding , and induction
soldering. In an infrared reflow
furnace application(assuming
63% Sn) the preheating time
will be approximately 60 sec.
at 120°C
to 150°C
followed by heating at 220°C
to 230°C.
* Sparkle
Paste OZ Powder
("Oxides
Zero" OZ uniformed sphere,
one white line in the photo
is 100µm.)
* After
Printing (Printed condition
in 50 time)
Fine printing
without "slumping"
keeping excellent resolution.
* After
Reflow (left in 24 hours)
Excellent
stability & very remaining
solder balls.
* Solder
Pastes : Typical Products
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Product's
Item
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Viscosity
(Pa.S)
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Pitch
(mm)
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Features
& Uses
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| OZ2062-330F-75-10 |
150
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0.65
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For hybrid IC and silver coated component soldering. |
| OZ2062-201C-50-9 |
200
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0.5
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Screen printing, hybrid IC, RMA type. |
| OZ63-221CM5-32-10 |
180
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0.3
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High reliability, RMA type, for 0.3mm time pitch exclusive
application. |
| OZ63-713C-40-9 |
190
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0.5
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Low residue, nitrogen reflow atmosphere, 1000ppm cxygen concentration. |
| OZ63-330F-40-10 |
250
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0.5
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High workability, RA type, standard paste. |
| OZ63-606F-AA-10.5 |
225
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0.5
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For cleaning in substitutive solvent(AK225) |
| OZ220-337F-53-10.5 |
200
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0.65
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High temp. soldering, high workability, melting temp. 221°C |
| OZ295-162F-50-8 |
170
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0.65
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High temp. soldering, high workability, melting temp. 285°C
to 296°C |
| OZ63-440C-53-11 |
100
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*0.5
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Rapid heating, good stable dispensing, RMA type. |
| OZ63-410FK-53-10 |
140
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*1.0
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For multi dispensing, no cleaning. |
| SS63-290-M4 |
230
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0.5
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Good wettability, for Nikkel and #42 alloy, equivalent in
reliability of RMA type after reflowed. |
| SSAT-233-M4 |
190
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0.5
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Prevention of tombstone for chip component, exclusive AT
alloy, RMA |
| SSAT-333-M4 |
190
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0.5
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Prevention of tombstone for chip component, medium viscosity. |
Eco
Solder
M31-221CM5-42-105 |
200
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0.4
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Pb-free solder Sn-Ag-Cu alloy, RA type. |
Eco
Solder
M31-381F5-10.5 |
200
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0.4
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Pb-free solder Sn-Ag-Cu alloy, RMA type. |
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